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Miniaturized oct package and assembly thereof

a technology of oct and package, which is applied in the field of miniaturization oct system design, can solve the problems of difficult miniaturization of oct system, and achieve the effect of maximizing the coupling efficiency of beams and aiding alignmen

Active Publication Date: 2016-08-18
MEDLUMICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patent describes a method of attaching a heat sink, photo detector, fiber mount, and scanning unit to a package. This method aims to maximize the coupling efficiency of a beam of light traveling between the photonic integrated circuit, photo detector, fiber mount, and scanning unit. The technical effects of this patent include improved heat dissipation, improved optical alignment, and increased coupling efficiency of light beams.

Problems solved by technology

Miniaturization of an OCT system is difficult due to the number of components required and the high coupling sensitivities between optical elements.

Method used

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Embodiment Construction

[0042]Although specific configurations and arrangements are discussed, it should be understood that this is done for illustrative purposes only. A person skilled in the pertinent art will recognize that other configurations and arrangements can be used without departing from the spirit and scope of the present invention. It will be apparent to a person skilled in the pertinent art that this invention can also be employed in a variety of other applications.

[0043]It is noted that references in the specification to “one embodiment,”“an embodiment,”“an example embodiment,” etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases do not necessarily refer to the same embodiment. Further, when a particular feature, structure or characteristic is described in connection with an embodiment, it would be within the kno...

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PUM

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Abstract

A chip package includes a housing, one or more electrical connections coupled to an exterior of the housing, a photonic integrated circuit, and a scanning unit. Both the photonic integrated circuit and the scanning unit are disposed within the housing. The photonic integrated circuit has at least one waveguide designed to guide a beam of light. The scanning unit is designed to laterally scan the beam of light across a focal plane outside of the housing. The scanning unit is aligned with the photonic integrated circuit such that the beam of light is coupled between the photonic integrated circuit and the scanning unit.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application claims the benefit of U.S. Provisional Application No. 62 / 113,170 filed Feb. 6, 2015, the disclosure of which is incorporated by reference herein in its entirety.BACKGROUND[0002]1. Field[0003]Embodiments of the invention relate to designs of a miniaturized OCT system.[0004]2. Background[0005]Optical coherence tomography (OCT) is an imaging technique that is widely used in many fields to provide depth-revolved imaging of various samples. The technique has found widespread use in the medical field where OCT data is used on skin and tissue to help diagnose various ailments as well as provide enhanced visual feedback to medical practitioners. Miniaturization of an OCT system is difficult due to the number of components required and the high coupling sensitivities between optical elements.BRIEF SUMMARY[0006]In the embodiments presented herein, designs of an integrated, miniaturized OCT system, and methods for fabricating such ...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): G01B9/02G02B26/08G02B6/27G02B6/42G02B6/30G02B6/32
CPCG02B6/4271G02B6/4269G02B6/4251G02B6/32G02B6/2766G01B9/02091G02B6/29346G02B26/0833G01B9/02051A61B5/0066G02B6/30G02B6/12007G02B6/4284A61B2562/0233A61B2562/228G02B6/4221G02B6/4226
Inventor LLORET SOLER, JUANSANCHO DURJUANRUBIO GUIVERNAU, JOSE LUISMARGALLO BALB S, EDUARDOLANDLES, WILLIAM KENNEDYCIFUENTES, ANDRESUNGAR, BLAIRZINOVIEV, KIRILL
Owner MEDLUMICS
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