Probe card
a technology of probes and electrodes, applied in the field of probes, can solve the problems of inclination of the object to be measured at the time of installation, failure to properly perform the measurement, and minute variations in height between each signal electrode, etc., to achieve a small overall spring coefficient, stably perform the measurement, and more stably held
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embodiment 1
[0033] Firstly a probe card according to a first embodiment of the invention will be described with reference to the attached drawings. FIG. 1 is a schematic sectional view of a probe card according to a first embodiment of the invention. FIG. 2 is a schematic plan view of the probe card which shows the arrangement of a supporting member and elastic members. FIG. 3 is a schematic diagram of probes used in the probe card. FIG. 4 is a schematic diagram of the probe shown in FIG. 3(a) that is provided with a reinforcing member. FIG. 5 is an enlarged sectional view of a part α shown in FIG. 1, which shows the probe card with the probe contacting a signal electrode of an object to be measured. FIG. 6 is a schematic sectional view of the probe card being in operation.
[0034] A probe card A shown in FIGS. 1 and 2, which is electrically connected to a measurement apparatus (not shown) for measuring various electrical properties of an object B to be measured (a semiconductor wafer) and is us...
embodiment 2
[0055] A probe card according to a second embodiment of the invention will now be described with reference to the attached drawings. FIG. 7 is a schematic sectional view of a probe card according to a second embodiment of the invention. FIG. 8 is a schematic plan view of the probe card which shows the arrangement of a supporting member and elastic members.
[0056] The probe cardA′ shown in FIGS. 7 and 8 has a configuration substantially similar to that of the probe card A. A large difference between the probe cards A and A′ is that a printed circuit board is employed as a main substrate 800 of the probe cardA′. Hereinafter, the difference will be described in detail, and repeated explanation of overlapping parts is omitted here. While reference numeral 800 designates the main substrate, the same reference numerals are applied to the other parts corresponding to Embodiment 1.
[0057] In the main substrate 800, there are provided a plurality of through holes 810 into which connecting pr...
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