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Heating circuit for integrated circuit

A technology of integrated circuits and heating circuits, applied in the direction of electric heating devices, electrical components, etc., can solve the problems of reducing heating efficiency and not being able to heat integrated circuits

Inactive Publication Date: 2019-02-15
YANGZHOU JIAYI METAL MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the traditional integrated circuit is in use, the heating circuit cannot effectively heat the integrated circuit, thereby reducing the heating efficiency

Method used

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Examples

Experimental program
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Effect test

Embodiment Construction

[0012] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0013] See figure 1 , The present invention provides a technical solution: the heating circuit of the integrated circuit includes a fixed frame 1, an integrated circuit 2 and a heating plate 3, the integrated circuit 2 and the heating plate 3 are placed inside the fixed frame 1, the integrated circuit 2 and the heating plate 3 is provided with a bolt 11 inside, which is connected to the integrated circuit 2 and the heating plate 3 throug...

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PUM

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Abstract

The invention relates to a heating circuit for an integrated circuit. The heating circuit comprises a fixing frame, an integrated circuit and a heating board, wherein the integrated circuit and the heating board are fixed inside the fixing frame; bolts are arranged on the integrated circuit and inside the heating board; the bolts are connected with the integrated circuit and the heating board through screw holes; an upper part of the integrated circuit is provided with a pressurized ball and a spring; a movable rod is arranged on upper parts of the pressurized ball and the spring; a lead, a fixing rod and a copper sheet are arranged on the inner side of the fixing frame; one end of the fixing rod is fixedly connected with the inner side of the fixing frame by welding, and the other end ismovably connected with a movable rod through a rotary shaft; and the copper sheet is fixedly connected with the inner side of the fixing frame by embedding. Through adoption of the heating circuit ofthe integrated circuit, the pressurized ball is arranged in the fixing frame, and the copper sheet is switched on / off under the control of the pressurized ball in order to control the on / off of the circuit of the heating board, so that the heating board is used for heating the integrated circuit under the control.

Description

Technical field [0001] The present invention relates to the technical field of integrated equipment, specifically a heating circuit of an integrated circuit. Background technique [0002] An integrated circuit is a miniature electronic device or component. A certain process is used to interconnect the transistors, resistors, capacitors and inductors and other components and wiring required in a circuit. When the traditional integrated circuit is in use, the heating circuit cannot effectively heat the integrated circuit, thereby reducing the heating efficiency. Summary of the invention [0003] The purpose of the present invention is to provide a heating circuit of an integrated circuit, which solves the problems raised in the background art. [0004] In order to achieve the above objective, the present invention provides the following technical solutions: the heating circuit of the integrated circuit includes a fixed frame, an integrated circuit and a heating plate, the integrated...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05B1/02
CPCH05B1/0208
Inventor 陆远林
Owner YANGZHOU JIAYI METAL MATERIAL CO LTD
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