Cooling structure for ultraprecise linear motor
A linear motor and cooling structure technology, applied in cooling/ventilation devices, electrical components, electromechanical devices, etc., can solve problems such as heat exchange and side temperature rise, and achieve the effect of suppressing heat exchange and increasing thrust density
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2013-01-16
Abstract
Description
technical field
[0001] The invention relates to a cooling structure of an ultra-precision linear motor, belonging to the technical field of linear motors. Background technique
[0002] The ultra-precision linear motor is the actuator that guarantees the operation of the ultra-precision servo system. With the development of nanotechnology and biotechnology, the requirements for thrust density and thrust accuracy of ultra-precision linear motors are gradually increasing, which leads to an increase in the current density of the motor windings, and the copper loss increases accordingly. Since the current ultra-precision position servo system uses a laser displacement sensor, it has high requirements on the constant temperature of the ambient temperature, and the ultra-precision servo system has a high integration density. During operation, the ultra-precision linear motor used is difficult. Avoid heat dissipation to the outside world, and the ultra-precise position servo system...
Examples
specific Embodiment approach 1
[0025] Specific implementation mode one: the following combination Figure 1 to Figure 6 Describe this embodiment, the cooling structure of the ultra-precision linear motor described in this embodiment, it includes a winding support part 1 and a winding 2, the winding 2 is fixed on the surface of the winding support part 1, it also includes a heat conduction part, the heat conduction part is arranged on the winding 2 and is fixedly connected with the winding support part 1.
specific Embodiment approach 2
[0026] Specific implementation mode two: the following combination figure 1 and figure 2 Describe this embodiment, this embodiment is a further description of Embodiment 1, the heat conduction part is a copper foil ring 31, the copper foil ring 31 is adapted to the outer contour of the winding 2, and is sleeved and fixed on the outside of the winding 2 On the surface.
[0027] In this embodiment, a layer of copper foil ring 31 is added on the side of the winding 2, and the copper foil ring 31, the winding 2 and the winding support part 1 can be glued and fixed by structural glue respectively, and the copper foil ring 31 and the winding The bonding glue between 2 should give priority to high thermal conductivity structural glue. In addition, when assembling, the upper and lower surfaces of the copper foil ring 31 should be in full contact with the upper water cooling plate and the lower water cooling plate, and high thermal conductivity glue can be used to fill them to ensu...
specific Embodiment approach 3
[0029] Specific implementation mode three: the following combination image 3 and Figure 4 Describe this embodiment. This embodiment is a further description of Embodiment 1. The heat conduction part is a copper foil heat conduction ring 32 composed of a plurality of copper foils distributed in sections. The copper foil heat conduction ring 32 and the winding 2 Adapted to the outer contour, each copper foil segment is fixed on the outer surface of the winding 2 .