Aqueous emulsion of ultraviolet-absorbing resin and emulsion resin composition

a technology of ultraviolet-absorbing resin and emulsion resin, which is applied in the field of aqueous (or water) emulsion of ultraviolet-absorbing resin and aqueous (or water) resin emulsion composition, can solve the problems of deterioration of transparency or mechanical strength in the aqueous emulsion resin, decrease in molecular weight, and decrease in strength

US20060155015A1Inactive Publication Date: 2006-07-13DAICEL CORP
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
Publication Date
2006-07-13
Estimated Expiration
Not applicable · inactive patent
Patent Text Reader

Abstract

An aqueous ultraviolet-absorbing resin emulsion, and an aqueous resin emulsion composition containing the emulsion is provided, wherein the emulsion is excellent in compatibility with a synthetic resin and light resistance. Also, the emulsion improves stability in blending with an aqueous emulsion of the synthetic resin, and prevents bleed out of the ultraviolet-absorbing resin on the surface of a coating film. Further, the aqueous ultraviolet-absorbing resin emulsion imparts excellent alkali or solvent resistance to a synthetic resin poor in alkali or solvent resistance. More specifically, an aqueous resin emulsion composition comprising (I) an aqueous ultraviolet-absorbing resin emulsion and (II) an other aqueous resin emulsion is provided, wherein the emulsion (I) is obtained by urethanizing (A) a polyol component having an ultraviolet-absorbing group {e.g., 1,1-bis[3-(2H-benzotriazol-2-yl)-4-hydroxy-benzeneethanol]methane}, (B) a polyol if necessary, (C) an alkyl or aryl dialkanolamine compound, and (D) an organic polyisocyanate in (E) an organic solvent, diluting the reaction mixture with (F) an organic solvent having a boiling point lower than 100° C. to give a resin solution, neutralizing the resin solution with (G) a neutralizing agent, and dispersing the resultant in water.
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Description

TECHNICAL FIELD

[0001] The present invention relates to an aqueous (or water) emulsion of an ultraviolet-absorbing resin, and an aqueous (or water) resin emulsion composition containing the emulsion, having excellent light resistance and chemical resistance. BACKGROUND ART

[0002] In recent years, from the viewpoint of environmental concerns, synthetic resins have been emulsified in water in various industrial fields such as automobiles, electric and electronic industries, and constructions. These aqueous (or water) emulsion resins (which mean resins contained in an aqueous emulsion, and sometimes refer to as aqueous resins) have the following disadvantages in the case where these resins are exposed to ultraviolet rays-containing light such as sunlight: these resins undergo deterioration or discoloration due to the ultraviolet rays, or cause decrease in molecular weight, resulting in decrease in strength thereof.

[0003] In order to improve the durability of the aqueous emulsion resin...

Examples

example 1

[0076] In a glass flask equipped with a cooling pipe, a nitrogen-introducing tube, a dropping funnel, a thermometer and a stirrer were charged 240 parts by weight of N,N-dimethylformamide (DMF) and 136.4 parts by weight of 1,1-bis-[3-(2H-benzotriazol-2-yl)-4-hydroxy-benzene ethanol]methane (trade name “MBEP”, manufactured by Otsuka Chemical Co., Ltd.), and the mixture was allowed to dissolve at 80° C. Then, 80.7 parts by weight of isophorone diisocyanate (IPDI) was added dropwise to the mixture under a nitrogen atmosphere with stirring, and the reaction was carried out for 2 hours. Further, 22.9 parts by weight of N-methyldiethanolamine was added dropwise thereto, and the reaction was continued for 4 hours.

[0077] Next, the reaction mixture was heated to 95° C. under a reduced pressure of 40 to 50 mmHg to remove 190 parts by weight of DMF from the reaction mixture, and diluted and dissolved with 240 parts by weight of methyl ethyl ketone (MEK). Then, 14.1 parts by weight of acetic a...

example 2

[0079] In the same device as Example 1, 240 parts by weight of N-methylpyrrolidone (NMP) and 136.4 parts by weight of the ultraviolet absorber MBEP used in Example 1 were charged, and allowed to dissolve at 80° C. Then, 80.7 parts by weight of isophorone diisocyanate (IPDI) was added dropwise to the mixture with stirring under a nitrogen atmosphere, and the reaction was carried out for 2 hours. Further, 22.9 parts by weight of N-methyldiethanolamine was added dropwise thereto, and the reaction was continued for 4 hours. The reaction mixture was heated to 95° C. under a reduced pressure of 40 to 50 mmHg to remove 190 parts by weight of DMF from the reaction mixture, and diluted and dissolved with 240 parts by weight of methyl ethyl ketone (MEK). Then, 14.1 parts by weight of acetic acid was added to the resulting mixture for quaternizing a tertiary amine portion in the resulting mixture. To the resultant was added dropwise 560 parts by weight of water to form an emulsion. Methyl ethy...