Optical transceiver module and optical cable module

a technology of optical transceiver and optical cable, which is applied in the direction of optical elements, instruments, semiconductor lasers, etc., can solve the problems of optical modules such as optical transceivers that are required to be further downsized, electrical i/o (input/output) signaling is not expected to keep pace with the demand for performance increases, and the electrical i/o signal rate is limited

US20210333496A1Active Publication Date: 2021-10-28YU SHENG PHOTOELECTRIC CO LTD
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
Publication Date
2021-10-28
Patent Text Reader

Abstract

An optical transceiver module and an optical cable module using the same are provided. The optical transceiver module: a substrate; at least one optical receiving device connected to the substrate; a plurality of optical transmitting devices connected to the substrate, wherein the optical transmitting devices comprise a plurality of first optical transmitting devices and a plurality of second optical transmitting devices, and the optical transmitting devices are misaligned to each other.
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Description

FIELD OF THE INVENTION

[0001] The present invention relates to an optical fiber communication technology field, and in particularly, to an optical transceiver module and an optical cable module using the same.BACKGROUND OF THE INVENTION

[0002] In the optical fiber communication technology, it is necessary to convert electrical signals into optical signals through an optical transceiver module (such as a laser device), and then to couple the optical signals into an optical fiber for transmitting. At present, the demand for computing devices continues to rise, even as the demand for computing devices to achieve higher performance also rises. However, conventional electrical I / O (input / output) signaling is not expected to keep pace with the demand for performance increases, especially for a higher performance computing expectations. Currently, I / O signals are sent electrically to and from the processor through the board and out to peripheral devices. Electrical signals must pass through so...

Examples

Embodiment Construction

[0038]The following embodiments are referring to the accompanying drawings for exemplifying specific implementable embodiments of the present invention. Furthermore, directional terms described by the present invention, such as upper, lower, front, back, left, right, inner, outer, side, etc., are only directions by referring to the accompanying drawings, and thus the used directional terms are used to describe and understand the present invention, but the present invention is not limited thereto.

[0039]The drawings and description are to be regarded as illustrative in nature and not restrictive. Like reference numerals designate like elements throughout the specification. In addition, the size and thickness of each component shown in the drawings allow ease of understanding and ease of description, but the present invention is not limited thereto.

[0040]In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. In the drawings, for understandi...